Last edited by Jukazahn
Wednesday, April 29, 2020 | History

3 edition of Thick film technology and chip joining found in the catalog.

Thick film technology and chip joining

  • 66 Want to read
  • 31 Currently reading

Published by Gordon and Breach in New York .
Written in English

    Subjects:
  • Microelectronics.,
  • Thick films.

  • Edition Notes

    Includes bibliographical references.

    Statement[by] Lewis F. Miller.
    SeriesProcesses and materials in electronics, v. 1
    Classifications
    LC ClassificationsTK7874 .M522
    The Physical Object
    Pagination221 p.
    Number of Pages221
    ID Numbers
    Open LibraryOL4469195M
    ISBN 100677034407
    LC Control Number79175344


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Thick film technology and chip joining by Lewis F. Miller Download PDF EPUB FB2

Additional Physical Format: Online version: Miller, Lewis F. Thick film Thick film technology and chip joining book and chip joining. New York, Gordon and Breach [] (OCoLC) For PtAu terminated resistors, the mean shear force of as-built samples on thick film Ag metallized substrates was 90 N, but dropped to N after hours at °C.

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